Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, Il Kwon Shim | 2023-12-12 |
| 11715703 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, KyoungHee Park | 2023-08-01 |