Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |