Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |
| 11735539 | Semiconductor device and method of forming discrete antenna modules | Choon Heung Lee, Junho Ye | 2023-08-22 |
| 11676911 | Method and device for reducing metal burrs when sawing semiconductor packages | DeokKyung Yang, HeeSoo Lee | 2023-06-13 |
| 11664327 | Selective EMI shielding using preformed mask | Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung +3 more | 2023-05-30 |
| 11652088 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, Sungsoo Kim, HeeSoo Lee | 2023-05-16 |
| 11587882 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2023-02-21 |