Issued Patents 2023
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11828016 | Clothes treatment apparatus and control method therefor | Beomjun Kim, Woore KIM, Bio Park, Seulgi Park, Jaehyuk Jang +2 more | 2023-11-28 |
| 11784133 | Shielded semiconductor package with open terminal and methods of making | KyoWang Koo, SungWon Cho, BongWoo Choi, Jiwon Lee | 2023-10-10 |
| 11756897 | Semiconductor device and method of forming a slot in EMI shielding with improved removal depth | JinHee Jung, Jiwon Lee, YuJeong Jang | 2023-09-12 |
| 11749668 | PSPI-based patterning method for RDL | JinHee Jung | 2023-09-05 |
| 11728281 | Shielded semiconductor packages with open terminals and methods of making via two-step process | KyoWang Koo, SungWon Cho, BongWoo Choi | 2023-08-15 |
| 11715703 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, Il Kwon Shim, InSang Yoon, KyoungHee Park | 2023-08-01 |
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin +2 more | 2023-06-27 |
| 11664327 | Selective EMI shielding using preformed mask | HunTeak Lee, Kyunghwan KIM, HeeSoo Lee, KyoungHee Park, JinHee Jung +3 more | 2023-05-30 |
| 11652065 | Semiconductor device and method of embedding circuit pattern in encapsulant for SIP module | JinHee Jung, HeeSoo Lee | 2023-05-16 |
| 11640944 | Semiconductor device and method of forming a slot in EMI shielding layer using a plurality of slot lines to guide a laser | JinHee Jung | 2023-05-02 |
| 11624138 | Laundry apparatus and control method thereof | Sangwook Hong | 2023-04-11 |
| 11616025 | Selective EMI shielding using preformed mask with fang design | KyoungHee Park, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2023-03-28 |
| 11610847 | Laser-based redistribution and multi-stacked packages | KyoungHee Park, Seonghwan Park, JinHee Jung | 2023-03-21 |
| 11581233 | Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module | JinHee Jung | 2023-02-14 |