Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |
| 11676911 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, HeeSoo Lee | 2023-06-13 |
| 11670618 | System-in-package with double-sided molding | Yongmin Kim, Jaehyuk Choi, YeoChan Ko, HeeSoo Lee | 2023-06-06 |
| 11652088 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | HunTeak Lee, Sungsoo Kim, HeeSoo Lee | 2023-05-16 |
| 11587882 | Molded laser package with electromagnetic interference shield and method of making | HunTeak Lee, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2023-02-21 |