Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670618 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670618 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, HeeSoo Lee | 2023-06-06 |