Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Jungrae Park, Zavier Zai Yeong Tan, Karthik Balakrishnan, James S. Papanu | 2023-12-26 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho +1 more | 2023-08-29 |
| 11705365 | Methods of micro-via formation for advanced packaging | Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Steven Verhaverbeke, Jean Delmas, Han-Wen Chen +1 more | 2023-06-13 |
| 11621194 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2023-04-04 |