Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Jungrae Park, Karthik Balakrishnan, James S. Papanu, Wei-Sheng Lei | 2023-12-26 |