Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Jungrae Park, Zavier Zai Yeong Tan, Karthik Balakrishnan, Wei-Sheng Lei | 2023-12-26 |
| 11764061 | Water soluble organic-inorganic hybrid mask formulations and their applications | Wenguang Li | 2023-09-19 |
| 11600492 | Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process | Sai Abhinand, Michael Lesley Sorensen, Karthik Elumalai, Dimantha Rajapaksa, Cheng Sun +4 more | 2023-03-07 |