Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721583 | Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules | Sriskantharajah Thirunavukarasu, Karthik Balakrishnan, Eng Sheng Peh | 2023-08-08 |
| 11600492 | Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process | Sai Abhinand, Michael Lesley Sorensen, Dimantha Rajapaksa, Cheng Sun, James S. Papanu +4 more | 2023-03-07 |