Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798903 | Methods of forming microvias with reduced diameter | Chintan Buch, Steven Verhaverbeke | 2023-10-24 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Giback Park, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |