Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798831 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2023-10-24 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2023-08-01 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Tapash Chakraborty +2 more | 2023-07-18 |