Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837680 | Substrate structuring methods | Han-Wen Chen, Giback Park | 2023-12-05 |
| 11798903 | Methods of forming microvias with reduced diameter | Chintan Buch, Roman Gouk | 2023-10-24 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho +2 more | 2023-07-18 |
| 11694912 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2023-07-04 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Wei-Sheng Lei, Jean Delmas, Han-Wen Chen +1 more | 2023-06-13 |
| 11566322 | Shadow mask with plasma resistant coating | Xi Huang, Fei Peng, Kiran Krishnapur, Ruiping Wang, Jrjyan Jerry CHEN +1 more | 2023-01-31 |