Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 |
| 11837464 | Methods, systems, and apparatus for tape-frame substrate cleaning and drying | Ying Wang, Gregory J. Wilson | 2023-12-05 |
| 11791094 | Semiconductor substrate having magnetic core inductor | Peng Suo, Yu Gu, Arvind Sundarrajan | 2023-10-17 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |