Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Arvind Sundarrajan | 2023-12-26 |
CY
Chang Bum Yong
Overall (2023): #482,119 of 537,848Top 90%
1
Patents 2023