Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854886 | Methods of TSV formation for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 |
| 11791094 | Semiconductor substrate having magnetic core inductor | Yu Gu, Guan Huei See, Arvind Sundarrajan | 2023-10-17 |