Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho +2 more | 2023-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho +2 more | 2023-07-18 |