Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621194 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2023-04-04 |
BE
Brad Eaton
Overall (2023): #501,966 of 537,848Top 95%
1
Patents 2023