Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784133 | Shielded semiconductor package with open terminal and methods of making | ChangOh Kim, KyoWang Koo, BongWoo Choi, Jiwon Lee | 2023-10-10 |
| 11763255 | Computerized systems and methods for managing inventory by grading returned products | Jong Woon Bae, Ha Dong Kang | 2023-09-19 |
| 11758788 | Method of manufacturing display panel with color control layer including wall bases having reflective layers on sidewalls thereof | Seon Uk LEE, Kanguk Kim, Sanggab Kim, Donchan Cho, Tae-Hyung Hwang +1 more | 2023-09-12 |
| 11728281 | Shielded semiconductor packages with open terminals and methods of making via two-step process | ChangOh Kim, KyoWang Koo, BongWoo Choi | 2023-08-15 |
| 11715703 | EMI shielding for flip chip package with exposed die backside | ChangOh Kim, Il Kwon Shim, InSang Yoon, KyoungHee Park | 2023-08-01 |
| 11688697 | Emi shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin +2 more | 2023-06-27 |