Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769677 | Substrate processing tool with integrated metrology and method of using | Kandabara Tapily | 2023-09-26 |
| 11764113 | Method of 3D logic fabrication to sequentially decrease processing temperature and maintain material thermal thresholds | Jeffrey Smith, Daniel Chanemougame, Lars Liebmann, Paul Gutwin, Anton J. deVilliers | 2023-09-19 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Kandabara Tapily +3 more | 2023-04-04 |
| 11594451 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Kandabara Tapily, Kai-Hung Yu | 2023-02-28 |