Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830852 | Multi-tier backside power delivery network for dense gate-on-gate 3D logic | Lars Liebmann, Jeffrey Smith, Daniel Chanemougame, Brian Tracy Cline, Xiaoqing Xu +1 more | 2023-11-28 |
| 11764113 | Method of 3D logic fabrication to sequentially decrease processing temperature and maintain material thermal thresholds | Jeffrey Smith, Daniel Chanemougame, Lars Liebmann, Robert D. Clark, Anton J. deVilliers | 2023-09-19 |
| 11764266 | Three-dimensional semiconductor device | Lars Liebmann, Jeffrey Smith, Daniel Chanemougame | 2023-09-19 |
| 11723187 | Three-dimensional memory cell structure | Lars Liebmann, Daniel Chanemougame | 2023-08-08 |
| 11581242 | Integrated high efficiency gate on gate cooling | Daniel Chanemougame, Lars Liebmann, Jeffrey Smith | 2023-02-14 |