Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830852 | Multi-tier backside power delivery network for dense gate-on-gate 3D logic | Lars Liebmann, Jeffrey Smith, Daniel Chanemougame, Paul Gutwin, Xiaoqing Xu +1 more | 2023-11-28 |
| 11625522 | Method and apparatus for generating three-dimensional integrated circuit design | Saurabh Sinha, Kyungwook Chang, Ebbin R. Southerland, Jr. | 2023-04-11 |
| 11569219 | TSV coupled integrated circuits and methods | Rahul Mathur, Xiaoqing Xu, Andy Wangkun Chen, Mudit Bhargava, Saurabh Sinha | 2023-01-31 |