Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682432 | Multi-tier memory architecture | Supreet Jeloka, Saurabh Sinha, Shidhartha Das, Mudit Bhargava | 2023-06-20 |
| 11670363 | Multi-tier memory architecture | Mudit Bhargava, Andy Wangkun Chen | 2023-06-06 |
| 11569219 | TSV coupled integrated circuits and methods | Xiaoqing Xu, Andy Wangkun Chen, Mudit Bhargava, Brian Tracy Cline, Saurabh Sinha | 2023-01-31 |