Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2023-04-04 |