Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804401 | Spacer-defined process for lithography-etch double patterning for interconnects | Ekmini Anuja De Silva, Luciana Meli Thompson, Yann Mignot | 2023-10-31 |
| 11699592 | Inverse tone pillar printing method using organic planarizing layer pillars | Ekmini Anuja De Silva, Praveen Joseph, Ashim Dutta | 2023-07-11 |
| 11695059 | Bottom source/drain etch with fin-cut-last-VTFET | Tao Li, Indira Seshadri, Eric R. Miller | 2023-07-04 |
| 11681213 | EUV pattern transfer using graded hardmask | Luciana Meli Thompson, Ashim Dutta, Ekmini Anuja De Silva | 2023-06-20 |
| 11682558 | Fabrication of back-end-of-line interconnects | Chi-Chun Liu, Ashim Dutta, Ekmini Anuja De Silva | 2023-06-20 |
| 11670510 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2023-06-06 |
| 11646221 | Self-aligned pattern formation for a semiconductor device | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Christopher J. Penny, Nicole Saulnier | 2023-05-09 |
| 11610780 | Alternating hardmasks for tight-pitch line formation | Sean D. Burns, Chi-Chun Liu, Yann Mignot, Stuart A. Sieg | 2023-03-21 |
| 11543751 | Organic photoresist adhesion to metal oxide hardmasks | Abraham Arceo de la Pena, Jennifer Church, Ekmini Anuja De Silva | 2023-01-03 |