Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837549 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2023-12-05 |
| 11817391 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2023-11-14 |
| 11810859 | Multi-layered adhesion promotion films | Srinivas V. Pietambaram, Rahul N. Manepalli, Cemil Geyik | 2023-11-07 |
| 11742275 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2023-08-29 |
| 11737227 | Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket | Zhichao Zhang, Gregorio R. Murtagian, Kuang Liu | 2023-08-22 |
| 11715889 | Slow wave structure for millimeter wave antennas | Zhichao Zhang, Jiwei Sun | 2023-08-01 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2023-07-04 |
| 11682613 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kaladhar Radhakrishnan | 2023-06-20 |
| 11621227 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2023-04-04 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Zhiguo Qian, Gang Duan, Jieying Kong | 2023-02-07 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Jianyong Xie, Yidnekachew S. Mekonnen, Zhiguo Qian | 2023-01-03 |