Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Junnan Zhao, Andrew J. Brown, Cheng Xu | 2023-11-28 |
| 11735535 | Coaxial magnetic inductors with pre-fabricated ferrite cores | Krishna Bharath, Clive R. Hendricks | 2023-08-22 |
| 11710720 | Integrated multi-die partitioned voltage regulator | Beomseok Choi, Siddharth Kulasekaran | 2023-07-25 |
| 11682613 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kemal Aygun | 2023-06-20 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Huong Do, William J. Lambert | 2023-06-13 |