Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811143 | Oam multiplexing communication system and inter-mode interference elimination method | Hirofumi Sasaki, Hiroyuki Fukumoto, Hiroyuki Shiba | 2023-11-07 |
| 11791230 | Fan-out semiconductor package | Joonsung Kim, Jinseon Park | 2023-10-17 |
| 11735532 | Semiconductor packages | Joonsung Kim, Taeho Ko, Bongsoo Kim, Seokbong Park | 2023-08-22 |
| 11721577 | Semiconductor package and method of manufacturing the same | Dowan KIM, Seunghwan Baek | 2023-08-08 |
| 11676915 | Semiconductor package | Taesung Jeong, Hongwon KIM, Junggon Choi | 2023-06-13 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Jongbo Shim +3 more | 2023-02-14 |