Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735532 | Semiconductor packages | Joonsung Kim, Doohwan Lee, Bongsoo Kim, Seokbong Park | 2023-08-22 |
| 11652076 | Semiconductor devices including thick pad | Daehee Lee, Hyunchul Jung | 2023-05-16 |