Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728283 | Package substrate and semiconductor package including the same | Chilwoo KWON, Jeongseok Kim | 2023-08-15 |
| 11676915 | Semiconductor package | Taesung Jeong, Doohwan Lee, Hongwon KIM | 2023-06-13 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Jongbo Shim +3 more | 2023-02-14 |