Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728283 | Package substrate and semiconductor package including the same | Chilwoo KWON, Junggon Choi | 2023-08-15 |
| 11721620 | Fan-out type semiconductor package | Myungsam Kang, Youngchan Ko, Bongju Cho | 2023-08-08 |
| 11700438 | Vision sensor and operating method thereof | Jaeho Baek, Jongseok Seo | 2023-07-11 |
| 11581284 | Semiconductor package with under-bump metal structure | Myungsam Kang, Youngchan Ko, Kyungdon Mun | 2023-02-14 |
| 11569175 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Youngchan Ko, Yieok Kwon, Gongje Lee +1 more | 2023-01-31 |
| 11569158 | Semiconductor package | Myungsam Kang, Youngchan Ko, Kyung Don Mun, Bongju Cho | 2023-01-31 |
| 11562966 | Semiconductor package | Myungsam Kang, Youngchan Ko, Bongju Cho | 2023-01-24 |