Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804444 | Semiconductor package including heat dissipation structure | Yongjin Park, Myungsam Kang, Seonho Lee | 2023-10-31 |
| 11784129 | Semiconductor package and method of fabricating the same | Myungsam Kang, Taesung Jeong | 2023-10-10 |
| 11721620 | Fan-out type semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2023-08-08 |
| 11626367 | Semiconductor package | Myungsam Kang, Kyungdon Mun | 2023-04-11 |
| 11581284 | Semiconductor package with under-bump metal structure | Myungsam Kang, Jeongseok Kim, Kyungdon Mun | 2023-02-14 |
| 11569175 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2023-01-31 |
| 11569158 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun, Bongju Cho | 2023-01-31 |
| 11562966 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2023-01-24 |