Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784129 | Semiconductor package and method of fabricating the same | Myungsam Kang, Youngchan Ko | 2023-10-10 |
| 11676915 | Semiconductor package | Doohwan Lee, Hongwon KIM, Junggon Choi | 2023-06-13 |