Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626367 | Semiconductor package | Myungsam Kang, Youngchan Ko | 2023-04-11 |
| 11581284 | Semiconductor package with under-bump metal structure | Myungsam Kang, Youngchan Ko, Jeongseok Kim | 2023-02-14 |
| 11569175 | Semiconductor package | Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2023-01-31 |