| 11847776 |
System using film thickness estimation from machine learning based processing of substrate images |
Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha |
2023-12-19 |
| 11836913 |
Film thickness estimation from machine learning based processing of substrate images |
Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha |
2023-12-05 |
| 11776109 |
Thickness measurement of substrate using color metrology |
Nojan Motamedi, Boguslaw A. Swedek, Martin A. Josefowicz |
2023-10-03 |
| 11715193 |
Color imaging for CMP monitoring |
Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid |
2023-08-01 |
| 11715672 |
Endpoint detection for chemical mechanical polishing based on spectrometry |
Jeffrey Drue David, Boguslaw A. Swedek |
2023-08-01 |
| 11701749 |
Monitoring of vibrations during chemical mechanical polishing |
Boguslaw A. Swedek, Chih Chung Chou, Nicholas A. Wiswell, Thomas H. Osterheld, Jeonghoon Oh |
2023-07-18 |
| 11699595 |
Imaging for monitoring thickness in a substrate cleaning system |
Jun Qian, Boguslaw A. Swedek, Thomas H. Osterheld |
2023-07-11 |
| 11682114 |
Thickness measurement of substrate using color metrology |
— |
2023-06-20 |
| 11660722 |
Polishing system with capacitive shear sensor |
Nicholas A. Wiswell, Chih Chung Chou |
2023-05-30 |
| 11577356 |
Machine vision as input to a CMP process control algorithm |
Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Boguslaw A. Swedek, Thomas H. Osterheld |
2023-02-14 |
| 11571786 |
Consumable part monitoring in chemical mechanical polisher |
Thomas H. Osterheld |
2023-02-07 |
| 11557048 |
Thickness measurement of substrate using color metrology |
Boguslaw A. Swedek |
2023-01-17 |
