Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532580 | Interconnect structure, semiconductor structure including interconnect structure and method for forming the same | Jung-Chou Tsai, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu | 2022-12-20 |
| 11532613 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Jui-Feng Kuan | 2022-12-20 |
| 11410929 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Ming-Fa Chen +1 more | 2022-08-09 |
| 11387177 | Package structure and method for forming the same | Chin-Her Chien, Po-Hsiang Huang, Cheng-Hung Yeh, TAI-YU WANG, MING-KE TSAI +6 more | 2022-07-12 |
| 11367695 | Interposer with capacitors | Fong-Yuan Chang, Cheng-Hung Yeh, Hsiang-Ho Chang, Po-Hsiang Huang, Chin-Her Chien +4 more | 2022-06-21 |
| 11282829 | Integrated circuit with mixed row heights | Kam-Tou Sio, Jiann-Tyng Tzeng, Chung-Hsing Wang | 2022-03-22 |