Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532613 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2022-12-20 |
| 11455453 | Integrated circuit design method, system and computer program product | Chi-Wen Chang | 2022-09-27 |
| 11314914 | Method and non-transitory computer readable medium of operating an electronic design automation platform for an optimal intgrated circuit design | Tsun-Yu Yang, Ren-Hong Fu, Chin-Cheng Kuo | 2022-04-26 |
| 11275880 | Region based shrinking methodology for integrated circuit layout migration | Chi-Wen Chang | 2022-03-15 |