Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532613 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Jui-Feng Kuan, Yi-Kan Cheng | 2022-12-20 |
| 11455453 | Integrated circuit design method, system and computer program product | Jui-Feng Kuan | 2022-09-27 |
| 11275880 | Region based shrinking methodology for integrated circuit layout migration | Jui-Feng Kuan | 2022-03-15 |