Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387177 | Package structure and method for forming the same | Chin-Her Chien, Po-Hsiang Huang, TAI-YU WANG, MING-KE TSAI, Yao-Hsien Tsai +6 more | 2022-07-12 |
| 11367695 | Interposer with capacitors | Fong-Yuan Chang, Hsiang-Ho Chang, Po-Hsiang Huang, Chin-Her Chien, Sheng-Hsiung Chen +4 more | 2022-06-21 |