Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387177 | Package structure and method for forming the same | Po-Hsiang Huang, Cheng-Hung Yeh, TAI-YU WANG, MING-KE TSAI, Yao-Hsien Tsai +6 more | 2022-07-12 |
| 11367695 | Interposer with capacitors | Fong-Yuan Chang, Cheng-Hung Yeh, Hsiang-Ho Chang, Po-Hsiang Huang, Sheng-Hsiung Chen +4 more | 2022-06-21 |
| 11222884 | Layout design methodology for stacked devices | Fong-Yuan Chang, Chin-Chou Liu, Po-Hsiang Huang, Ka Fai Chang | 2022-01-11 |