Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532580 | Interconnect structure, semiconductor structure including interconnect structure and method for forming the same | Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Yi-Kan Cheng | 2022-12-20 |