Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532549 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang | 2022-12-20 |
| 11532547 | Interconnect structures with low-aspect-ratio contact vias | Cheng-Hsiung Tsai, Chung-Ju Lee | 2022-12-20 |
| 11482451 | Interconnect structures | Guanyu Luo, Shin-Yi Yang, Shau-Lin Shue | 2022-10-25 |
| 11462470 | Method of forming graphene and metallic cap and barrier layers for interconnects | Shin-Yi Yang, Shau-Lin Shue | 2022-10-04 |
| 11450602 | Hybrid method for forming semiconductor interconnect structure | Shih-Kang Fu, Shau-Lin Shue | 2022-09-20 |
| 11404366 | Hybrid interconnect structure for self aligned via | Shin-Yi Yang, Shau-Lin Shue | 2022-08-02 |
| 11342219 | Chemical mechanical polishing topography reset and control on interconnect metal lines | Shih-Kang Fu | 2022-05-24 |
| 11322391 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Chien-Hsin Ho | 2022-05-03 |
| 11309241 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Hsin-Yen Huang, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu | 2022-04-19 |
| 11296026 | Semiconductor device and manufacturing method thereof | Shau-Lin Shue | 2022-04-05 |