Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532549 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2022-12-20 |
| 11309241 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Meng-Pei Lu | 2022-04-19 |