Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532549 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Shu-Wei Li, Yu-Chen Chan, Ming-Han Lee | 2022-12-20 |
| 11482451 | Interconnect structures | Guanyu Luo, Ming-Han Lee, Shau-Lin Shue | 2022-10-25 |
| 11462470 | Method of forming graphene and metallic cap and barrier layers for interconnects | Ming-Han Lee, Shau-Lin Shue | 2022-10-04 |
| 11404366 | Hybrid interconnect structure for self aligned via | Ming-Han Lee, Shau-Lin Shue | 2022-08-02 |
| 11309241 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu | 2022-04-19 |