Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532549 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2022-12-20 |
SL
Shu-Wei Li
Overall (2022): #261,500 of 548,613Top 50%
1
Patents 2022