Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450602 | Hybrid method for forming semiconductor interconnect structure | Ming-Han Lee, Shau-Lin Shue | 2022-09-20 |
| 11342219 | Chemical mechanical polishing topography reset and control on interconnect metal lines | Ming-Han Lee | 2022-05-24 |