Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322391 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Ming-Han Lee | 2022-05-03 |
CH
Chien-Hsin Ho
Overall (2022): #500,524 of 548,613Top 95%
1
Patents 2022