Issued Patents 2022
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |
| 11282816 | Memory packages and methods of forming same | Chen-Hua Yu, Chung-Hao Tsai, Yih Wang | 2022-03-22 |
| 11264316 | Package structure and method of manufacturing the same | Chun-Lin Lu, Kai-Chiang Wu | 2022-03-01 |
| 11244939 | Package structure and method of forming the same | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen | 2022-02-08 |
| 11244896 | Package structure and manufacturing method thereof | Min-Chien Hsiao, Chao-Wen Shih, Han-Ping Pu, Chieh-Yen Chen | 2022-02-08 |
| 11239157 | Package structure and package-on-package structure | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen | 2022-02-01 |
| 11222883 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2022-01-11 |