Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532528 | Electronic package and manufacturing method thereof | Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Don-Son Jiang | 2022-12-20 |
| 11521930 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2022-12-06 |
| 11516925 | Package stack structure and method for manufacturing the same | Han-Hung Chen, Yuan-Hung Hsu, Rung-Jeng Lin, Fu-Tang Huang | 2022-11-29 |
| 11482470 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2022-08-09 |
| 11398429 | Electronic package and manufacturing method thereof | Cheng-Kai Chang, Don-Son Jiang | 2022-07-26 |
| 11380978 | Electronic package and method for fabricating the same | Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu | 2022-07-05 |
| 11289794 | Electronic package | Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Kuo-Hua Yu | 2022-03-29 |
| 11289346 | Method for fabricating electronic package | Chen-Yu Huang, Chee-Key Chung, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2022-03-29 |
| 11227842 | Electronic package and substrate structure having chamfers | Po-Hao Wang, Chun-Tang Lin, Bo-Hao Chang | 2022-01-18 |