Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521930 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2022-12-06 |
| 11482470 | Electronic package and fabrication method thereof | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2022-08-09 |